MARC details
000 -LEADER |
fixed length control field |
05742cam a22004457i 4500 |
001 - CONTROL NUMBER |
control field |
18152615 |
005 - DATE AND TIME OF LATEST TRANSACTION |
control field |
20171008100537.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
fixed length control field |
140515s2013 maua b 000 0 eng d |
010 ## - LIBRARY OF CONGRESS CONTROL NUMBER |
LC control number |
2012474549 |
015 ## - NATIONAL BIBLIOGRAPHY NUMBER |
National bibliography number |
GBB372159 |
Source |
bnb |
016 7# - NATIONAL BIBLIOGRAPHIC AGENCY CONTROL NUMBER |
Record control number |
016473144 |
Source |
Uk |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
International Standard Book Number |
9781608075270 (cloth) |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
International Standard Book Number |
1608075273 (cloth) |
035 ## - SYSTEM CONTROL NUMBER |
System control number |
(OCoLC)ocn856198255 |
040 ## - CATALOGING SOURCE |
Original cataloging agency |
UKMGB |
Language of cataloging |
eng |
Description conventions |
rda |
Transcribing agency |
UKMGB |
Modifying agency |
OCLCO |
-- |
YDXCP |
-- |
BTCTA |
-- |
IPL |
-- |
UPM |
-- |
EGM |
-- |
DLC |
042 ## - AUTHENTICATION CODE |
Authentication code |
lccopycat |
050 00 - LIBRARY OF CONGRESS CALL NUMBER |
Classification number |
TK7875 |
Item number |
.C67 2013 |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
Classification number |
621.381 |
Edition number |
23 |
100 1# - MAIN ENTRY--PERSONAL NAME |
Personal name |
Costello, Suzanne. |
245 10 - TITLE STATEMENT |
Title |
Hermeticity testing of MEMS and microelectronic packages / |
Statement of responsibility, etc |
Suzanne Costello, Marc P.Y. Desmulliez. |
250 ## - EDITION STATEMENT |
Edition statement |
1st ed. |
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
Date of publication, distribution, etc |
2013 |
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE STATEMENTS |
Place of production, publication, distribution, manufacture |
Boston : |
Name of producer, publisher, distributor, manufacturer |
Artech House, |
Date of production, publication, distribution, manufacture |
[2013] |
300 ## - PHYSICAL DESCRIPTION |
Extent |
195 pages : |
Other physical details |
illustrations ; |
Dimensions |
24 cm. |
336 ## - CONTENT TYPE |
Content Type Term |
text |
Content Type Code |
txt |
Source |
rdacontent |
337 ## - MEDIA TYPE |
Media Type Term |
unmediated |
Media Type Code |
n |
Source |
rdamedia |
338 ## - CARRIER TYPE |
Carrier Type Term |
volume |
Carrier Type Code |
nc |
Source |
rdacarrier |
490 1# - SERIES STATEMENT |
Series statement |
Integrated microsystems series |
504 ## - BIBLIOGRAPHY, ETC. NOTE |
Bibliography, etc |
Includes bibliographical references and index. |
505 0# - FORMATTED CONTENTS NOTE |
Formatted contents note |
Machine generated contents note: References -- pt. 1 Introduction to Hermetic Packages and Leak Types -- 1.The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication -- 1.1.Introduction -- 1.2.The Evolution of Microelectronics and MEMS Packages -- 1.3.MEMS Sealing Techniques and Mode Package Fabrication -- 1.3.1.Materials -- 1.3.2.Sealing Techniques -- 1.4.Summary of MEMS Packaging Materials and Techniques -- References -- 2.Assembly, Packaging, and Environmentally Induced Failures in MEMS -- 2.1.Introduction -- 2.2.Particle Contamination -- 2.3.Thermomechanical Constraints -- 2.3.1.Thermomechanical Constraints in Die Attach -- 2.3.2.Thermomechanical Constraints in Package-Level Encapsulation -- 2.3.3.Thermomechanical Constraints in Wafer-Level Encapsulation -- 2.3.4.Thermomechanical Constraints in Flip-Chip Bonding -- 2.4.Moisture and Gas Absorption -- 2.4.1.Moisture Absorption -- 2.4.2.Barrier Coatings: A Protection Against Moisture Absorption -- 2.4.3.Outgassing -- 2.5.Conclusions: Reliability Demonstration and Accelerated Testing -- References -- 3.Packaging Requirements for Hermeticity -- 3.1.The Need for Hermeticity in MEMS and Microelectronics Packaging -- 3.2.Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package -- References -- 4.The Different Types of Leaks in MEMS and Microelectronics Packaging -- 4.1.Introduction -- 4.2.Leak Channels or Capillary Leaks -- 4.3.Permeation -- 4.4.Outgassing -- 4.5.Conclusion -- References -- pt. 2 Traditional Hermeticity Test Techniques and Standards -- 5.Ex Situ Hermeticity Test Methods -- 5.1.Introduction -- 5.2.Fine Leak Tests -- 5.2.1.Helium Fine Leak Test -- 5.2.2.Radioisotope Leak Detection Method -- 5.3.Gross Leak Tests -- 5.3.1.Fluorocarbon Liquid and Vapor Gross Leak Detection -- 5.3.2.Gross Bubble Test -- 5.3.3.Weight Gain -- 5.3.4.Dye Penetrant Gross Leak Test -- 5.4.Combinational Tests -- 5.4.1.Optical Fine/Gross Leak Detection Method -- 5.4.2.Cumulative Helium Leak Detection (CHLD) Method -- References -- 6.The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 -- 6.1.Introduction: The First Hermeticity Tests -- 6.2.The Introduction of the Military Standards -- 6.3.The First Problems with Traditional Hermeticity Tests and Standards -- 6.4.Military Standard Revisions -- 6.5.Summary -- References -- pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages -- 7.Permeation -- 7.1.Introduction -- 7.2.Mathematics of Permeation -- 7.3.Limitations of the Packaging Material -- 7.4.Conclusions -- References -- 8.Outgassing and Residual Gas Analysis (RGA) -- 8.1.Outgassing -- 8.2.Residual Gas Analysis -- References -- 9.Low-Cavity Volume Capillary Leak Limitations -- 9.1.Limitations of the Helium Fine Leak Test Method -- 9.1.1.Volume Limitations -- 9.1.2.Minimum Detectable Leak Rate -- References -- pt. 4 Novel Methods of Leak Detection -- 10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method -- 10.1.Introduction -- 10.2.Lumped Element Modeling of a Microresonator -- 10.3.Definitions and Measurement Methods of the Quality Factor Q -- 10.3.1.Definition in Terms of Stored Energy -- 10.3.2.Definition in Terms of Bandwidth -- 10.3.3.Determination of the Q-Factor by Amplitude-Frequency Measurement -- 10.3.4.Determination of the Q-Factor by Phase Measurement -- 10.4.Relation Between Pressure and Q-Factor -- References -- 11.In Situ Test Methods in Development -- 11.1.Introduction -- 11.2.Copper Test Structures -- 11.3.Micro-Pirani Gauge -- References -- 12.Ex Situ Hermeticity Test Methods in Development -- 12.1.Introduction -- 12.2.FTIR Spectroscopy -- 12.2.1.Application to Hermeticity -- 12.2.2.Theoretical Limitations -- 12.2.3.Practical Considerations -- 12.2.4.Summary -- 12.3.Raman Spectroscopy -- 12.3.1.Application to the Hermeticity Test -- 12.3.2.Theoretical Limitations -- 12.3.3.Practical Considerations -- 12.3.4.Summary -- References -- pt. 5 Conclusions and Vision -- 13.Summary of Hermeticity Test Methods -- 14.The Way Forward -- 14.1.Introduction -- 14.2.Improvement on Existing Techniques -- 14.3.New Hermetic Materials and Hermeticity Test Methods -- 14.4.Conclusions -- References. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Microelectromechanical systems. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Microelectronics. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Microelectromechanical systems |
General subdivision |
Testing. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Microelectronics |
General subdivision |
Testing. |
700 1# - ADDED ENTRY--PERSONAL NAME |
Personal name |
Desmulliez, Marc P. Y., |
Dates associated with a name |
1963- |
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE |
Uniform title |
Artech House integrated microsystems series. |
906 ## - LOCAL DATA ELEMENT F, LDF (RLIN) |
a |
7 |
b |
cbc |
c |
copycat |
d |
2 |
e |
ncip |
f |
20 |
g |
y-gencatlg |
942 ## - ADDED ENTRY ELEMENTS (KOHA) |
Source of classification or shelving scheme |
Dewey Decimal Classification |
Item type |
Books |